The term 3D IC generally means an IC package having multiple device layers, which is
different with 3D transistor structures such as the FinFET. 3D packaging and 3D integration …

Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active
devices, have the potential to dramatically enhance chip performance, functionality, and …

It has long been known that photonic communication can alleviate the data movement
bottlenecks that plague conventional microelectronic processors. More recently, there has …

Concern about the performance of wires wires in scaled technologies has led to research
exploring other communication methods. This paper examines wire and gate delays as …

A significant part of future microprocessor real estate will be dedicated to 12 or 13 caches.
These on-chip caches will heavily impact processor performance, power dissipation, and …

Reconfigurable Computing marks a revolutionary and hot topic that bridges the gap
between the separate worlds of hardware and software design—the key feature of …

Growing wire delays will force substantive changes in the designs of large caches.
Traditional cache architectures assume that each level in the cache hierarchy has a single …

This paper presents a new method for branch prediction. The key idea is to use one of the
simplest possible neural networks, the perceptron, as an alternative to the commonly used …

While research has shown that the agile chip design methodology is promising to sustain
the scaling of computing performance in a more efficient way, it is still of limited usage in …

The theory of latency-insensitive design is presented as the foundation of a new correct-by-
construction methodology to design complex systems by assembling intellectual property …