During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

As temperature cycling drives fatigue failure of solder joints in electronic modules,
characterisation of the thermal fatigue response of different solder alloy formulations in BGA …

Reliability of lead-free solders, used in harsh conditions such as in automotive, is still a
serious concern. Simultaneous additions of multiple alloying elements like Bismuth (Bi) …

This study aims to enhance the properties of eutectic Sn–9Zn (SZ) alloys as a replacement
for low-melting Sn–Pb alloys by adding 0.5–3.0 wt% In, forming SZ–In (SZI) alloys (referred …

A new unified creep‐plasticity (UCP) constitutive model coupled with damage is proposed
for Sn–3.0 Ag–0.5 Cu (SAC305), one of the most successfully commercialized Pb‐free …

Abstract Adding Ag to Sn–25Sb solder to prepare Sn–25Sb-xAg (x= 0, 2.5, 3.0 and 3.5, x is
the mass percentage) solder alloys. Using optical microscope, JSM-5610LV field emission …

The effect of the rotating magnetic field (RMF) on the microstructure and properties of Sn-1.0
Ag-0.5 Cu-0.5 Sb-0.07 Ce alloy was investigated. The phase composition of the solder was …

Solder interconnections, also known as solder joints, are the weakest link in electronics
packaging. Reliability of these miniature joints is of utmost interest-especially in safety …

This paper presents a compact and time-efficient reduced-order modelling method for
thermal-mechanical analysis and material nonlinearity study of power electronics modules …

Abstract Sn-Ag-Cu (SAC) alloys have been identified as promising replacements for
standard 63Sn-37Pb eutectic solder after the restriction in legislation of lead (Pb) in …