A novel packaged ultra-high Q silicon MEMS butterfly vibratory gyroscope
L Jia, G Han, Z Wei, C Si, J Ning, F Yang, W Han - Micromachines, 2022 - mdpi.com
A novel three-dimensional (3D) wafer-level sandwich packaging technology is here applied
in the dual mass MEMS butterfly vibratory gyroscope (BFVG) to achieve ultra-high Q factor. A …
in the dual mass MEMS butterfly vibratory gyroscope (BFVG) to achieve ultra-high Q factor. A …
A Novel Fabrication Method for a Capacitive MEMS Accelerometer Based on Glass–Silicon Composite Wafers
Y He, C Si, G Han, Y Zhao, J Ning, F Yang - Micromachines, 2021 - mdpi.com
In this paper, we report a novel teeter-totter type accelerometer based on glass-silicon
composite wafers. Unlike the ordinary micro-electro-mechanical systems (MEMS) …
composite wafers. Unlike the ordinary micro-electro-mechanical systems (MEMS) …
Research on a capacitive MEMS pressure sensor based on through glass via
Y Fu, F He, L Jia, G Han, C Si… - Microwave and Optical …, 2024 - Wiley Online Library
The paper reports the fabrication and characterization of a capacitive Microelectro
Mechanical Systems pressure sensor based on through glass vias (TGV), which had a large …
Mechanical Systems pressure sensor based on through glass vias (TGV), which had a large …
[PDF][PDF] Development of spiral square coils for magnetic labelling detection in microfluidic systems
A Feddag, NE Mekkakia-Maaza… - International Journal of …, 2023 - academia.edu
Due to the development of microfluidic systems biomedical microelectromechanical systems
(BioMEMS) for magnetic labelling detection by magnetic microbeads circling in microfluidic …
(BioMEMS) for magnetic labelling detection by magnetic microbeads circling in microfluidic …
[PDF][PDF] A Novel Fabrication Method for a Capacitive MEMS Accelerometer Based on Glass–Silicon Composite Wafers. Micromachines 2021, 12, 102
Y He, C Si, G Han, Y Zhao, J Ning, F Yang - 2021 - pdfs.semanticscholar.org
In this paper, we report a novel teeter-totter type accelerometer based on glass-silicon
composite wafers. Unlike the ordinary micro-electro-mechanical systems (MEMS) …
composite wafers. Unlike the ordinary micro-electro-mechanical systems (MEMS) …