Power module packaging technologies have been experiencing extensive changes as the
novel silicon carbide (SiC) power devices with superior performance become commercially …

This article reviews the design and evaluation of different DC-DC converter topologies for
Battery Electric Vehicles (BEVs) and Plug-in Hybrid Electric Vehicles (PHEVs). The design …

In order to take the full advantage of the high-temperature SiC and GaN operating devices,
package materials able to withstand high-temperature storage and large thermal cycles …

This review traces the development of silver (Ag) as a die attach bonding material in the
microelectronic packaging industry from its' early days as micron-scale silver flakes to the …

New types of die attach pastes comprising micron-sized Ag particles hybridized with
submicron-sized Ag particles were considered as lead-free die attach materials for SiC …

Highly conductive Cu–Cu interconnections of SiC die with Ti/Ni/Cu metallization and direct
bonded copper substrate for high-power semiconductor devices are achieved by the low …

Abstract Properties such as high hardness, low density, and high elastic modulus have
made SiC ceramics proper choices for a variety of industrial applications. However …

An oxidation-reduction bonding (ORB) was applied to achieve Cu-Cu bonding with
microscale Cu particle paste. During sintering at 300° C, Cu 2 O nanoparticles were …

Despite the rapid progression of silicon carbide (SiC) power devices, the thermal
characteristic evaluation during power cycling at high temperature (> 200° C) is an issue. In …

A novel die-attach material, Cu particle paste with self-reduction and self-protection
characteristics, was designed by simply adding ascorbic acid (AA) into Cu paste. The self …