This review investigates the measurement methods employed to assess the geometry and
electrical properties of through-silicon vias (TSVs) and examines the reliability issues …

Recent advances in semiconductor technology offer vertical interconnect access (via) that
extend through silicon, popularly known as through silicon via (TSV). This book provides a …

This paper introduces a class of programmable metamaterials, whose electromagnetic
properties can be controlled via software. These software defined metamaterials (SDMs) …

Multilayer graphene nanoribbons (MLGNRs) have potentially provided attractive solutions in
an intensely growing researched area of interconnects. However, for MLGNR interconnects …

The investigation of crosstalk issues for coupled through silicon vias (TSVs) in ternary logic
is presented in this study. The crosstalk issues are analyzed for coupled TSVs utilizing multi …

This article presents a technique to improve the crosstalk effects in ternary coupled through
silicon vias (TSVs). The effects of crosstalk are investigated in TSVs using multi walled …

This paper presents a new approach to implement a compact resistance–inductance–
capacitance–conductance (RLCG) model for carbon nanotube (CNT) and Cu-based …

This paper introduces the electrical equivalent circuit model of Cu-Multi walled Carbon
Nanotube Heterogeneous Coaxial Through Silicon Vias (Cu-MWCNT HCTSV). Multi-walled …

Through-silicon-via (TSV) interposers using silicon and copper represent a critical element
in microelectronic packaging, as they bridge between fine-pitch inputs/outputs at the …

The metal–semiconductor (MES)-based through silicon vias (TSV) has provided attractive
solutions over conventional metal–insulator–semiconductor (MIS) TSVs in recent three …