Wide bandgap (WBG) device-based power electronics converters are more efficient and
lightweight than silicon-based converters. WBG devices are an enabling technology for …

Semiconductor power modules are core components of power electronics in electrified
vehicles. Packaging technology often has a critical impact on module performance and …

To facilitate the development of thermoelectric modules for various operating temperature
ranges, a connection technology that is suitable for heat-sensitive thermoelectric materials …

Silicon-Carbide (SiC) devices with superior performance over traditional silicon power
devices have become the prime candidates for future high-performance power electronics …

In order to take the full advantage of the high-temperature SiC and GaN operating devices,
package materials able to withstand high-temperature storage and large thermal cycles …

Wide bandgap (WBG) devices are a desirable choice for high-density energy conversion
systems. In high-speed hard-switching applications, voltage overshoot across device …

A review is provided, which first considers low-temperature diffusion bonding with silver
nanomaterials as filler materials via thermal sintering for microelectronic applications, and …

Silver (Ag) has been under development for use as interconnect material for power
electronics packaging since the late 1980s. Despite its long development history, high …

This review traces the development of silver (Ag) as a die attach bonding material in the
microelectronic packaging industry from its' early days as micron-scale silver flakes to the …

There has been a significant rise in the number of research papers on silver nanoparticle
based solutions for harsh environment die attach. However, sintering nanoparticles is a …