Due to its special physical properties, diamond is widely applied in the field of mechanical
processing. The brazing technology is exploited with strong bonding force between the …

High-power insulated gate bipolar transistor (IGBT) modules are the key devices for energy
change and transmission. Reflow soldering process is a crucial process in IGBT module …

Flip chip technology has been used extensively in microelectronic packaging due to the high
density, fine spacing, smaller size. However, the size and spacing of the solder bumps are …

Herein, we investigated the interfacial reactions of crystalline Pd (pure Pd) and amorphous
Pd (Pd (P)) layers in thin electroless-Ni electroless-Pd immersion-Au (thin-ENEPIG) surface …

This study explores the application of Convolutional Neural Networks (CNN) in predicting
the partitioned homogeneous properties (PHPs) of electronic product wiring structures …

In this paper, a new constitutive model of SnAgCu lead-free solder, which covered the low-
temperature and elevated-temperature creep properties, was constructed according to the …

Abstract Surface Mounted Devices (SMDs) are widely used throughout microelectronics and
power electronics. They mostly employ epoxy molding compound (EMC) based …

A combination of nanoindentation mapping and machine-earning (ML) modeling has been
used to characterize the microstructural changes in SnPb solder balls exposed to thermal …

A new cell-less boundary element method formulation is presented for two-step
thermoelastic analyses. The first step is a steady-state thermal analysis. The second step is …

Purpose Surface mount technology (SMT) is widely used and plays an important role in
electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on …