Molded embedded bridge for enhanced EMIB applications
SV Pietambaram, RN Manepalli - US Patent 10,892,219, 2021 - Google Patents
Disclosed is an embedded multi-die interconnect bridge (EMIB) substrate. The EMIB
substrate can comprise an organic substrate, a bridge embedded in the organic sub strate …
substrate can comprise an organic substrate, a bridge embedded in the organic sub strate …
Molded embedded bridge including routing layers for enhanced EMIB applications
SVR Pietambaram, RN Manepalli - US Patent 11,600,563, 2023 - Google Patents
H01L23/522—Arrangements for conducting electric current within the device in operation
from one component to another, ie interconnections, eg wires, lead frames including …
from one component to another, ie interconnections, eg wires, lead frames including …
Package structure with dummy die
HW Chen, L Huang - US Patent 11,721,676, 2023 - Google Patents
H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid
state devices; Multistep manufacturing processes thereof all the devices being of a type …
state devices; Multistep manufacturing processes thereof all the devices being of a type …