(57) ABSTRACT A nanowire array is described herein. The nanowire array comprises a
substrate and a plurality of nanowires extending essentially vertically from the substrate; …

(56) References Cited 2004/0043607 A1 3/2004 Farnworth et al. 2004/0051173 A1 3, 2004
Koh et al. US PATENT DOCUMENTS 2004/006 1238 A1 4/2004 Sekine 2004/0104454 A1 …

(57) ABSTRACT A microelectronic unit includes a microelectronic element, eg, an integrated
circuit chip, having a semiconductor region of monocrystalline form. The semiconductor …

A method and apparatus for improving the planarity of a recessed color filter array when the
recessed region or trench depth exceeds the thickness of the color filter film. The method …

US8405196B2 - Chips having rear contacts connected by through vias to front contacts -
Google Patents US8405196B2 - Chips having rear contacts connected by through vias to …

BACKGROUND 0002. This relates generally to imaging devices, and more particularly, to
imaging devices with multiple lenses and image sensors. 0003 Image sensors are …

Described herein is a device comprising: a Substrate; one or more of a nanostructure
extending essentially perpendicu larly from the substrate; wherein the nanostructure …

A phase change material (PCM) switch is disclosed that includes a resistive heater element,
and a PCM element proximate the resistive heater element. A thermally conductive electrical …

A solid state image sensor includes a microelectronic element having a front face and a rear
face remote from the front face, the rear face having a recess extending towards the front …

This chapter reviews modern manufacturing techniques for backside illuminated (BSI)
CMOS image sensors (CISs). It presents a thorough discussion regarding the advantages …