Polishing compositions and methods for removing conduc tive materials from a substrate
surface are provided. In one aspect, a composition includes an acid based electrolyte …

(54) METHOD AND COMPOSITION FOR 10/032,275, filed on Dec. 21, 2001, now Pat. No.
POLISHINGA SUBSTRATE 6,899,804, application No. 11/196,876, which is a continuation …

Polishing compositions and methods for removing conduc tive materials and barrier
materials from a substrate surface are provided. Polishing compositions are provided for …

An apparatus and method for planarizing a surface of a Substrate using a chamber
separated into two parts by a membrane, and two separate electrolytes is provided. The …

Polishing compositions and methods for removing conduc tive materials from a substrate
surface are provided. In one aspect, a method is provided for processing a Substrate to …

The invention provides a polishing composition and a method of chemically-mechanically
polishing a substrate comprising a noble metal, the polishing composition comprising (a) an …

An electrolytic liquid is used for electrolytic polishing which can provide a processed surface
having high flattening characteristics with a low voltage applied while ensuring a higher …

US7485241B2 - Chemical-mechanical polishing composition and method for using the same -
Google Patents US7485241B2 - Chemical-mechanical polishing composition and method for …

SUMMARY OF THE INVENTION 0005 The present invention provides compositions for
electro-chemical-mechanical polishing (e-CMP) of chip interconnect materials. These …

The invention provides a chemical-mechanical polishing composition for polishing a
substrate. The polishing com position comprises an abrasive, an oxidizing agent, an …