Investigation of the Sn-0.7 wt.% Cu solder reacting with C194, alloy 25, and C1990 HP substrates
AD Laksono, TY Tsai, TH Chung, YC Chang, YW Yen - Metals, 2022 - mdpi.com
Cu-based alloys are one of the most promising substrates to enhance the performance of
lead-frame materials. In the present study, the interfacial reactions in the Sn-0.7 wt.% Cu …
lead-frame materials. In the present study, the interfacial reactions in the Sn-0.7 wt.% Cu …
Nickel-Cobalt Alloy Deposition on Iron Substrate Using Electroless Deposition in Deep Eutectic Solvent
Electroless deposition of Ni has been successfully done via deep eutectic solvent (DES)
ionic liquid. In this study, a binary Ni-Co alloy is deposited on iron substrate using …
ionic liquid. In this study, a binary Ni-Co alloy is deposited on iron substrate using …
Effect of Contact Pad's Roughness and Ni–P Plating Thickness on Leadless Packages' Shear Strength Variation
Studies on shear strength of thin small leadless packages (TSLP) focused predominantly on
solder and reflow factors. Contact pad's surface roughness (R a) and Ni–P thickness factors …
solder and reflow factors. Contact pad's surface roughness (R a) and Ni–P thickness factors …
Thin Small Leadless Package's (TSLP): Adhesion Failure Analysis After Electroless Nickel Immersion Gold (ENIG) Process
CG Ong - 2018 IEEE 38th International Electronics …, 2018 - ieeexplore.ieee.org
Electroless Nickel Immersion Gold (ENIG) plating could offer superior durability and high
corrosion resistance as well as providing excellent solderability. However, in plating …
corrosion resistance as well as providing excellent solderability. However, in plating …