[图书][B] Through silicon vias: materials, models, design, and performance
Recent advances in semiconductor technology offer vertical interconnect access (via) that
extend through silicon, popularly known as through silicon via (TSV). This book provides a …
extend through silicon, popularly known as through silicon via (TSV). This book provides a …
Impact of interconnect spacing on crosstalk for multi-layered graphene nanoribbon
VR Kumbhare, PP Paltani… - IETE Journal of Research, 2022 - Taylor & Francis
In the recent research world, the overall system performance primarily depends on
interconnect delay instead of the gate delay at the nanoscale regime. The impact of spacing …
interconnect delay instead of the gate delay at the nanoscale regime. The impact of spacing …
Temperature-dependent modeling and performance evaluation of multi-walled CNT and single-walled CNT as global interconnects
The influence of temperature on multi-walled carbon nanotube (MWCNT) interconnects
have been studied. A temperature-dependent equivalent circuit model is presented for the …
have been studied. A temperature-dependent equivalent circuit model is presented for the …
Mathematical framework of tetramorphic MWCNT configuration for VLSI interconnect
Having a 1D material like Multiwall Carbon Nanotube (MWCNT) as a potential candidate for
high speed Very Large Scale Integration (VLSI) interconnect creates a good scope to reduce …
high speed Very Large Scale Integration (VLSI) interconnect creates a good scope to reduce …
Structure fortification of mixed CNT bundle interconnects for nano integrated circuits using constraint-based particle swarm optimization
The emerging VLSI technology and simultaneously highly dense packaging of devices and
interconnects in nano-scale chips have prosperously enabled realization of system-on-chip …
interconnects in nano-scale chips have prosperously enabled realization of system-on-chip …
Comprehensive model for high-speed current-mode signaling in next generation MWCNT bundle interconnect using FDTD technique
The performance of current-mode signaling (CMS) scheme in carbon nanomaterial based
multiwall carbon nanotube (MWCNT) bundle on-chip interconnect using finite-difference …
multiwall carbon nanotube (MWCNT) bundle on-chip interconnect using finite-difference …
A theoretical modeling of adaptive mixed cnt bundles for high-speed vlsi interconnect design
The aroused quest to reduce the delay at the interconnect level is the main urge of this
paper, so as to come across a configuration of carbon nanotube (CNT) bundles, namely …
paper, so as to come across a configuration of carbon nanotube (CNT) bundles, namely …
Dielectric surface roughness scattering induced crosstalk performance of coupled MCB interconnects
A CMOS inverter driven equivalent single conductor model of capacitively coupled mixed
CNT bundle (MCB) interconnects are taken to analyze the crosstalk induced time domain …
CNT bundle (MCB) interconnects are taken to analyze the crosstalk induced time domain …
Analysis of multilayer graphene nanoribbon interconnects constrained by structural edge roughness and corrugated surface dielectric
The transient response, 3 dB bandwidth, and relative stability of undoped‐and doped‐
multilayer graphene nanoribbon (MLGNR) interconnects are investigated based on the …
multilayer graphene nanoribbon (MLGNR) interconnects are investigated based on the …
Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation—Part II: CNT Interconnect Optimization
The size and parameter optimization for the 5-nm carbon nanotube field effect transistor
(CNFET) static random access memory (SRAM) cell was presented in Part I of this article …
(CNFET) static random access memory (SRAM) cell was presented in Part I of this article …