Structure and properties of lead-free solders bearing micro and nano particles
L Zhang, KN Tu - Materials Science and Engineering: R: Reports, 2014 - Elsevier
Composite lead-free solders, containing micro and nano particles, have been widely
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …
Properties and Microstructures of Sn‐Ag‐Cu‐X Lead‐Free Solder Joints in Electronic Packaging
L Sun, L Zhang - Advances in Materials Science and …, 2015 - Wiley Online Library
SnAgCu solder alloys were considered as one of the most popular lead‐free solders
because of its good reliability and mechanical properties. However, there are also many …
because of its good reliability and mechanical properties. However, there are also many …
[图书][B] Carbon nanotubes: reinforced metal matrix composites
This discovery of carbon nanotubes (CNT) three decades ago ushered in the technological
era of nanotechnology. Among the most widely studied areas of CNT research is their use …
era of nanotechnology. Among the most widely studied areas of CNT research is their use …
[HTML][HTML] Sn-3.0 Ag-0.5 Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
Abstract Package-on-Package (PoP) is a popular technology for fabricating chipsets of
accelerated processing units. However, the coefficient of thermal expansion mismatch …
accelerated processing units. However, the coefficient of thermal expansion mismatch …
Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux
H Wang, X Hu, X Jiang, Y Li - Journal of Manufacturing Processes, 2021 - Elsevier
Cu modified carbon nanotubes (Cu-CNTs) doped flux were prepared in this paper, the
influence of the composite flux on the evolution of microstructure and shear strength of Sn …
influence of the composite flux on the evolution of microstructure and shear strength of Sn …
Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3. 5Ag0. 5Cu solder joint under current stressing
In this work, multi-walled carbon nanotubes (MWCNTs) with various weight percentages of
0.01 wt%, 0.05 wt%, 0.1 wt% were incorporated into Sn3. 5Ag0. 5Cu (SAC) solder matrix by …
0.01 wt%, 0.05 wt%, 0.1 wt% were incorporated into Sn3. 5Ag0. 5Cu (SAC) solder matrix by …
Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging
Trace amount of rare earth Ce (0.03 wt.%) was added into SnAgCu solder in order to reform
the properties of the solder. In this study, interface reaction mechanism during thermal …
the properties of the solder. In this study, interface reaction mechanism during thermal …
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3. 5AgXCu solder
SY Chang, CC Jain, TH Chuang, LP Feng, LC Tsao - Materials & Design, 2011 - Elsevier
In this work, TiO2 nanoparticles were successfully incorporated into Sn3. 5Ag and Sn3.
5Ag0. 7Cu solder, to synthesize novel lead-free composite solders. Effects of the TiO2 …
5Ag0. 7Cu solder, to synthesize novel lead-free composite solders. Effects of the TiO2 …
Application of ZnO nanoparticles in Sn99Ag0. 3Cu0. 7-based composite solder alloys
The properties of Sn99Ag0. 3Cu0. 7 (SACX0307) solder alloy reinforced with ZnO
nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm …
nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm …
Interfacial reaction of Sn‐Ag‐Cu lead‐free solder alloy on Cu: A review
LM Lee, AA Mohamad - Advances in Materials Science and …, 2013 - Wiley Online Library
This paper reviews the function and importance of Sn‐Ag‐Cu solder alloys in electronics
industry and the interfacial reaction of Sn‐Ag‐Cu/Cu solder joint at various solder forms and …
industry and the interfacial reaction of Sn‐Ag‐Cu/Cu solder joint at various solder forms and …