Connecting chips within a module is a basic requirement in transforming MMIC performance
to system functionality. More and more applications demand for operation at high mm-wave …

This dissertation concerns the design of circuits and systems for an emerging technology
known as three-dimensional integration. By stacking individual components, dice, or whole …

In the past, microsystems packaging played two roles: 1) It provided I/O connections to and
from devices, referred to as IC or wafer level packaging, and 2) It interconnected both active …

AlGaN/GaN high electron mobility transistors (HEMT) on sapphire substrates have been
studied for their potential application in RF power applications; however, the low thermal …

The successful deployment of wireless systems requires the integration of small, cost-
effective antennas while preserving a reasonable electrical performance in the required …

The design, fabrication and performance of a 60-GHz multi-chip module receiver employing
a substrate integrated waveguide filter and antenna are presented. The receiver is …

In the current trend toward portable applications, high-Q integrated inductors have gained
considerable importance. Hence, much effort has been spent to increase the performance of …

In this paper, a 77-GHz automotive radar sensor transceiver front-end module is packaged
with a novel embedded wafer level packaging (EMWLP) technology. The bare transceiver …

In this work, we demonstrated the thermal analysis of different flip-chip bonding designs for
high power GaN HEMT developed for power electronics applications, such as power …

The design of an out-of-phase planar power divider/combiner operating over an octave
frequency band is presented. The proposed device uses a modified single-section Gysel …