A balanced substrate-integrated waveguide (SIW) bandpass filter (BPF) is designed and
fabricated based on through-quartz-via (TQV) technologies in this article. Sixthorder filtering …

A miniaturized substrate integrated waveguide bandpass filter with an area of 0.682× 0.210
mm 2 is proposed based on through-silicon via (TSV) technology for terahertz (THz) …

Miniaturization trends in high-frequency electronics have led to accommodation challenges
in the integration of the corresponding components. Size reduction thereof has become a …

Based on three-dimensional (3-D) integration technology, a compact sixth-order common-
mode noise suppression filter is proposed according to delay line theory. As the important …

By using integrated lumped elements based on through-silicon via (TSV) technology, a 3-D
low-pass filter (LPF) with ultracompact size and ultrawide stopband is proposed. The 3-D …

In this letter, an ultra-compact wideband stepped impedance resonators'(SIR) interdigital
bandpass filter (IBPF) is proposed based on through-silicon via (TSV) and three …

In this article, the differential inductor, widely used as an inductive element, is modified as a
resonator. This differential drive inductor resonator (DDIR) can achieve miniature size and …

To improve the misalignment tolerance for inductive power transfer (IPT) systems in
implantable medical devices, like retinal prosthesis, a 3-D through silicon via (TSV) based …

A range of ultracompact bandpass filters (BPFs) exploited circular-substrate-integrated
waveguide (CSIW) with low insertion loss (IL) and high selectivity are proposed based on …

Redistribution layer (RDL) and through silicon via (TSV) are the two main important
packaging methods of the heterogeneous integration, here we report on the interconnection …