This article is the second article in a three-part series dedicated to reviewing each process
step in crystalline silicon (c-Si) photovoltaic (PV) module manufacturing process: feedstock …

The diamond wire sawing is superior for the wafers manufacturing in the photovoltaic and
semiconductor industry. In this research, analytical models were emphasized and …

The photovoltaic (PV) industry requires efficient cutting of large single and multi-crystalline
(sc-and mc-) silicon (Si) wafers. Historically multi-wire slurry sawing (MWSS) dominated, but …

Systematic cutting process design and optimization problems are studied for surface
roughness minimization by stochastic algorithms. As the experimental background of the …

A larger breakage ratio occurs with the decrease of wafer thickness due to the decrease of
fracture strength for as sawn silicon wafers, which is a severe problem to limit the production …

Surface characteristics and damage distributions of diamond wire sawn wafers for silicon
solar cells Page 1 AIMS Materials Science, 3(2): 669-685. DOI: 10.3934/matersci.2016.2.669 …

We have evaluated surface characteristics of diamond wire cut (DWC) wafers sawn under a
variety of cutting parameters. These characteristics include surface roughness, spatial …

Diamond microparticles undergo changes to their structure and stress state during diamond-
coated wire sawing of Si ingots. This phenomenon is revealed using confocal, micro-Raman …

This chapter discusses the preparation and properties of silicon wafers in detail.
Microelectromechanical systems (MEMS) manufacturing sets special requirements for …

The objective of this study is to recover SiC from silicon wafer cutting slurry using physical
separation and acid/alkali purification processes. Hydrocyclone was used in the first-stage …