The study investigated the growth kinetics and rate-controlling processes of intermetallic
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …

The growth kinetics and rate-controlling processes of intermetallic layers formed in Cu/(Sn-
58 wt% Bi) diffusion couples were investigated. Isothermal annealing of diffusion couples …

In this study, we focused on unraveling the intricate world of intermetallic compound
formation at the interface of solid Fe and liquid Al–Mg–Si alloy. Our primary aim was to shed …

This study delves into the intricate interaction between multi-walled carbon nanotubes
(MWCNTs) and the Sn–Ag–Cu solder system, highlighting its relevance in lead-free …

This study focuses on the practical relevance of the Al-Ag bonding interface in electronic
device fabrication, particularly in wire bonding, which is crucial for enhancing component …

Sn is the main interconnect material for three-dimensional (3D) Packaging of chip stacking
in electronic packaging. In this paper, the intermetallic compound (IMC) produced through …

The growth behavior of compounds for the reactive diffusion between solid Cu and molten
binary Bi-Sn alloys was experimentally examined using semi-infinite diffusion couples …

This study investigates the growth and microstructure formation of intermetallic compounds
at the solid/liquid interface of a Co/Zn diffusion couple prepared using an isothermal …

Electroplating crystalline cobalt–phosphorus (Co–P, with 1~ 8 at.% P) is a potential
interfacial layer for electronic packaging solder joints, however, the optimal content of P has …

In this study, a novel composite solder, Sn-3.5 Ag-10.0 Co, was tailored for transient liquid
phase (TLP) bonding in electric vehicle power module integration. Employing a meticulous …