Accelerated lifetime tests (ALTs) play a critical role in long-term reliability studies of SiC
MOSFETs, including lifetime estimation, failure analysis, and condition monitoring. This …

Metallized film capacitor (MFC) selection is a key step to ensure the safe and reliable
operation of high-capacity power electronic equipment. However, as a crucial factor leading …

Press‐pack insulated gate bipolar transistor modules (PP‐IGBTs) have been widely used in
high‐voltage and high‐power‐density applications, such as high‐voltage direct‐current …

Reliability-oriented evaluation of power module has emerged as a pivotal aspect in
addressing the demands of high-reliability design and cost-effective maintenance for electric …

AC power cycling tests allow the most realistic reliability assessment by applying close to
real stress to the device or module under test to meet functional safety standards, which is …

Power semiconductor chips are paralleled in modules to increase current rating. Under
thermo-mechanical stresses in service, the die-attach solder layers will gradually develop …

The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-
gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack …

With the development of high power converters, the safe operation of large IGBT modules
with parallel chips is of increasing importance. In a multichip module, uneven solder layer …

Operational and health management for the reliability of power electronic converters
requires sensitive condition monitoring and accurate estimation of the remaining lifetime …

Failure mechanisms investigation (FMI) is crucial for reliability evaluation of power modules,
and thus, attracts high popularity in power converters. However, complex failure modes …