The study investigated the growth kinetics and rate-controlling processes of intermetallic
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …

Abstract The Cu-Al composite material possesses a large potential value in practical
application due to its excellent properties. Whereas the Cu/Al interface is an inevitable issue …

The growth kinetics and rate-controlling processes of intermetallic layers formed in Cu/(Sn-
58 wt% Bi) diffusion couples were investigated. Isothermal annealing of diffusion couples …

A novel external axial magnetic field (EMF) hybrid CMT welding-brazing process was
adopted to join pure titanium TA2 and aluminum alloy 6061-T6. The effects of the magnetic …

In this study, we focused on unraveling the intricate world of intermetallic compound
formation at the interface of solid Fe and liquid Al–Mg–Si alloy. Our primary aim was to shed …

The transition behavior from a Nb–Ni precursor to porous Nb and the coarsening of
ligaments by a dealloying reaction in a Mg melt are investigated. Based on these results, the …

This study delves into the intricate interaction between multi-walled carbon nanotubes
(MWCNTs) and the Sn–Ag–Cu solder system, highlighting its relevance in lead-free …

The transition behavior from a Ti–Cu alloy to nanoporous α-Ti, the kinetics of the dealloying
reaction, and the coarsening of nanoporous α-Ti were studied, and the mechanism of …

This study elucidates the formation of distinct phases, such as intermetallic compounds
(IMCs), and the evolution of Kirkendall voids. We not only observed the emergence of …

This study investigates the microstructural evolution and growth behavior of intermetallic
compound (IMC) layers in the Cu/(Sn-yAg, y= 0.29∼ 2.00 wt.%) system during isothermal …