Solar cell market is led by silicon photovoltaics and holds around 92% of the total market.
Silicon solar cell fabrication process involves several critical steps which affects cell …

One dimensional photonic crystal has been developed as a broadband dielectric reflector,
the stopband of which could be selectively tuned based on absorption spectrum of the …

Copper is a low-cost, low-damage alternative to Ag paste for front-side metallization of
crystalline Si (c-Si) solar cells, but requires conductive diffusion barriers like Ni or NiSi …

Due to the lower cost compared to screen-printed silver contacts, the Ni/Cu/Ag contacts
formed by plating have been continuously studied as a potential metallization technology for …

Ni/Cu/Ag contact formed by plating has continuously been studied as a future metallization
technique of solar cells due to the lower cost of material and better electrical performance …

NiSi as a conductive diffusion barrier to silicon has been studied. We demonstrate that the
NiSi films formed using the single step annealing process are as good as the two step …

-In this paper, a potassium hydroxide solution was used to etch the surface of the mono-
crystalline silicon wafer, the sample was prepared at 0.33 Mol, solution temperature 82° C …

In this study accelerated ageing testing (AAT), J–V characterization and TEM imaging in
combination with phase diagram data from literature are used to assess the potential of Ti …

Light-induced plating on laser-structured passivation layer openings is an alternative
method to silver screen printing for fabrication of the front-side metal grid on silicon solar …

Exposing a plasma-enhanced chemical vapor deposition-deposited silicon nitride (SiNx)
film to an inert gasoxidizing plasma ambient results in a significant reduction in background …