Method of fabrication of a Al/Ge bonding in a wafer packaging environment and a product produced therefrom
SS Nasiri, AF Flannery - US Patent 7,442,570, 2008 - Google Patents
US7442570B2 - Method of fabrication of a AL/GE bonding in a wafer packaging
environment and a product produced therefrom - Google Patents US7442570B2 - Method …
environment and a product produced therefrom - Google Patents US7442570B2 - Method …
Vertically integrated MEMS structure with electronics in a hermetically sealed cavity
SS Nasiri, AF Flannery - US Patent 7,104,129, 2006 - Google Patents
(57) ABSTRACT A MEMS assembly having a MEMS subassembly sand wiched between
and bonded to a cap and a base is provided. The MEMS subassembly includes at least one …
and bonded to a cap and a base is provided. The MEMS subassembly includes at least one …
Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures
M Daneman, M Lim, K Huang, I Tchertkov - US Patent 9,540,230, 2017 - Google Patents
A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS
wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric …
wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric …
MEMS device with release aperture
CH Lin, CH Chu, CW Cheng - US Patent 8,716,051, 2014 - Google Patents
The present disclosure provides a method of fabricating a micro-electro-mechanical systems
(MEMS) device. In an embodiment, a method includes providing a substrate including a first …
(MEMS) device. In an embodiment, a method includes providing a substrate including a first …
Micro electromechanical system sensor and method of forming the same
CW Cheng, HC Tsai, LL Chao, YC Hsieh… - US Patent …, 2017 - Google Patents
A micro electromechanical system (MEMS) device includes a MEMS section attached to a
substrate, and a cap bonded to a first surface of the substrate. The MEMS device further …
substrate, and a cap bonded to a first surface of the substrate. The MEMS device further …
Method for sealing and backside releasing of microelectromechanical systems
F Ayazi - US Patent 7,767,484, 2010 - Google Patents
Disclosed are methods for fabricating encapsulated microelectromechanical systems
(MEMS) devices. A MEMS device fabricated on a CMOS wafer is encapsulated using an …
(MEMS) devices. A MEMS device fabricated on a CMOS wafer is encapsulated using an …
MEMS device with release aperture
CH Lin, CH Chu, CW Cheng - US Patent 8,962,367, 2015 - Google Patents
(57) The present disclosure provides a method of fabricating a micro-electro-mechanical
systems (MEMS) device. In an embodiment, a method includes providing a substrate includ …
systems (MEMS) device. In an embodiment, a method includes providing a substrate includ …
Integrated MEMS devices with controlled pressure environments by means of enclosed volumes
K Huang, M Lim, SS Nasiri - US Patent 8,350,346, 2013 - Google Patents
An integrated MEMS device comprises a wafer where the wafer contains two or more
cavities of different depths. The MEMS device includes one movable structure within a first …
cavities of different depths. The MEMS device includes one movable structure within a first …
Process for a sealed mems device with a portion exposed to the environment
MJ Daneman, M Lim, J Seeger, I Tchertkov… - US Patent App. 13 …, 2013 - Google Patents
BACKGROUND 0003. Many MEMS devices, specifically those measuring or modifying
aspects of the environment outside of the device (eg pressure sensors, microphones …
aspects of the environment outside of the device (eg pressure sensors, microphones …
Method of forming a seal for a semiconductor device
BP Gogoi, RM Roop, HD Desai - US Patent 7,585,744, 2009 - Google Patents
In one embodiment, a reflowable layer 51 is deposited over a semiconductor device 10 and
reflowed in an environment having a pressure approximately equal to that of atmosphere to …
reflowed in an environment having a pressure approximately equal to that of atmosphere to …