(57) ABSTRACT A stackable microelectronic package includes a first micro electronic die
attached to and electrically connecting with a first substrate. A second microelectronic die is …

A method of manufacture of an integrated circuit packaging system includes: providing a first
board-on-chip-structure having a first integrated circuit die mounted over a substrate and the …

(57) ABSTRACT A stackable microelectronic package includes a first micro electronic die
attached to and electrically connecting with a first substrate. A second microelectronic die is …

(57) ABSTRACT A package-on-package stacked microelectronic structure comprising a pair
of microelectronic packages attached to one another in a flipped configuration. In one …

A microelectronic assembly includes a dielectric element having at least one aperture and
electrically conductive elements thereon including terminals exposed at the second surface …

The present invention is an apparatus and method for allowing for the use of commercial
dual inline memory module (DIMM) in high shock and vibration environments while …

The pesent invention discloses a memory module and a signal line arrangement method
thereof. The memory module includes memory chips mounted on both sidees in a mirror …

An electronic component includes a first component and a second component, each having
a surface that includes a plurality of exposed contacts separated by an insulating material. A …

US7981703B2 - Electronic assemblies without solder and methods for their manufacture -
Google Patents US7981703B2 - Electronic assemblies without solder and methods for their …

The disclosure relates generally to apparatus and tech niques for mitigating signal
reflections for signals in a data processing system, and more specifically relates to a connec …