As the rapid development of advanced foldable electronic devices, flexible and insulating
composite films with ultra-high in-plane thermal conductivity have received increasing …

As technology advances toward ongoing circuit miniaturization and device size reduction
followed by improved power density, heat dissipation is becoming a key challenge for …

The problem of icing for surfaces of engineering structures requires attention more and more
every year. Active industrialization in permafrost zones is currently underway; marine …

This research presents the successful development and optimization of a spiropyran-
assisted cellulose aerogel (CNF-SP) aerogel with UV-induced switchable wettability, and …

There exists more than one-third of the stock of buildings that do not meet energy-saving
building standards, so there is an urgent need for breakthroughs in the field of green …

The thermal conductivity of polymer composites could be improved through the orientation of
fillers in specific directions. Here, a novel strategy to fabricate BN/Ag nanowires@ Ni/epoxy …

The advent of the 5G era has significantly increased device power density and integration,
intensifying heat dissipation challenges in electronic devices. The exploration and …

Herein, we report a cooling fabric with thermal conduction and radiative cooling capabilities
through grafting hydroxylated boron nitride (BN-OH) nanosheets onto the surface of cotton …

With the integration and miniaturization of chips, there is an increasing demand for improved
heat dissipation. However, the low thermal conductivity (TC) of polymers, which are …

The problem of icing for surfaces of engineering structures requires attention more and more
every year. Active industrialization in permafrost zones is currently underway; marine …