Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …

An experimental approach to control the fracture behavior of 3D nanopatterned structures in
real time and to describe the microcrack propagation in solids quantitatively is presented …

This study presents a novel approach of micromechanical interfacial testing in loading mode
III. The interfaces beneath single copper interconnect structures are investigated. The …

This paper describes the use of the double cantilever beam (DCB) method for characterizing
the adhesion strength of interfaces in advanced microelectronic packages at room and high …

Mechanical failures of back-end-of-line (BEoL) interconnects represent a critical yield and
reliability concern for integrating new materials such as ultralow-permittivity (ultralow-k) …

The motivation of this thesis was to control crack steering into regions of engineered 3D-
nanopatterned structures with high fracture toughness and to determine the local critical …

A novel experimental setup for testing interface properties of single copper interconnect
structures is presented. The method is based on in-situ SEM nanoindentation experiments …

Quantitative characterization of interface adhesion and fracture properties of thin film
materials is of fundamental and technological interests in modern technologies. Sandwich …

The mechanical robustness of microelectronic products is a serious reliability concern,
particularly for microchips and chipsets operated in harsh environments, for use cases that …

The PhD research has been an integral and substantial part of my life for many years. These
were years filled with exciting experiments, thrilling ideas and hypotheses, thought …