With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder
has attracted wide attention due to its excellent comprehensive performance and low cost. In …

Electronic devices need to work at high temperature in some fields for a long time, peculiarly
step soldering technology, primary packaging and flip–chip connections, etc., along with the …

This review covers recent applications of wet etching on solder alloys. Detailed
characterization cases are presented and discussed accordingly to highlight the process …

In the present work, three near-eutectic lead-free solder melts of Sn-8wt.% Zn; Sn-8wt.% Zn-
2wt.% Bi and Sn-8wt.% Zn-4wt.% Bi have swiftly solidified by means of the melt-spinning …

This research investigated the combined effects of addition of Bi and Sb elements on the
microstructure, thermal properties, ultimate tensile strength, ductility, and hardness of Sn-0.7 …

Abstract Zn–30Sn–2Cu–0.5 Ni–0.2 Al (ZnSnCuNiAl) solder joints were isothermally aged in
the temperature range of 100–170° C for up to 360 h, and the growth behavior and kinetics …

Abstract In this study, Sn–Ag–Cu solder alloys and Sn–Ag–Cu solder alloys reinforced with
0.1 wt% Ag-graphene nanosheets (Ag-GNSs) by mechanical mixing (H for abbreviation) and …

An experimental investigation has been conducted with respect to the influence of
permanent magnet stirring (PMS) under different rotation speeds (0, 60, 120, 180 rpm) on …

This study examines the passive film properties of Sn-5Sb alloy processed through Equal
Channel Angular Pressing (ECAP) for application in gas turbine bearing pads. The alloy …

Three distinct alloy/substrate couples were considered. In order to treat the reaction interface
problem effectively, sheets of commercially pure copper (Cu), electrolytic nickel (Ni) and low …