Ever since the construction of the first integrated circuits (IC's) in the late fifties, an effort to
increase the speed of the ICs by decreasing the linear dimensions of its components has …

The electron scattering at surfaces, interfaces, and grain boundaries is investigated using
polycrystalline and single-crystal Cu thin films and nanowires. The experimental data is …

We report the electric conductivity of three-dimensional (3D) nanoporous gold at low
temperatures and in strong magnetic fields. It was found that topologically disordered 3D …

We report the resistivity of 5 Cu films approximately 65 nm thick, measured between 5 and
290 K, and the transverse magnetoresistance and Hall effect measured at temperatures 5 …

The electron scattering at surfaces and grain boundaries is investigated using
polycrystalline Au films deposited onto mica substrates. We vary the three length scales …

The resistivity of metallic structures depends on both electron-grain boundary scattering and
electron-surface scattering. By tuning the grain size, we have been able to separate the …

We report the Hall effect measured in gold films evaporated onto mica substrates, the
samples having an average grain diameter D that ranges between 12 and 174 nm, and a …

We calculate the electrical resistivity of a metallic specimen, under the combined effects of
electron scattering by impurities, grain boundaries, and rough surfaces limiting the film …

We report the Hall constant RH⁠, drift mobility μ D⁠, and Hall mobility μ H measured at 4 K
in thin gold films deposited on mica substrates, where the dominant electron scattering …

We report the measurement of the longitudinal magnetoresistance, performed on 4 thin gold
films of different thickness evaporated onto preheated mica, where the signal can be …