A review of lead-free solders for electronics applications
Ever since RoHS was implemented in 2006, Sn3. 0Ag0. 5Cu (SAC305) has been the
primary lead-free solder for attaching electronic devices to printed circuit boards (PCBs) …
primary lead-free solder for attaching electronic devices to printed circuit boards (PCBs) …
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products
DA Shnawah, MFM Sabri, IA Badruddin - Microelectronics reliability, 2012 - Elsevier
Currently, the portable electronic products trend to high speed, light weight, miniaturization
and multifunctionality. In that field, solder joint reliability in term of both drop impact and …
and multifunctionality. In that field, solder joint reliability in term of both drop impact and …
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
PF Yang, YS Lai, SR Jian, J Chen, RS Chen - Materials Science and …, 2008 - Elsevier
We report in this paper Young's moduli and hardness of Cu6Sn5, Cu3Sn, and Ni3Sn4
intermetallic compounds (IMCs) measured by nanoindentation. The samples were prepared …
intermetallic compounds (IMCs) measured by nanoindentation. The samples were prepared …
A study of nanoparticles in Sn–Ag based lead free solders
M Amagai - Microelectronics Reliability, 2008 - Elsevier
Co, Ni, Pt, Al, P, Cu, Zn, Ge, Ag, In, Sb or Au inclusions in Sn–Ag based lead free solders
were evaluated to study if these nanoparticles can reduce the growth of intermetallic …
were evaluated to study if these nanoparticles can reduce the growth of intermetallic …
Fatigue reliability analysis of Sn–Ag–Cu solder joints subject to thermal cycling
In this paper, thermal cycling tests and finite-element analysis (FEA) for a plastic ball grid
array package with Sn-3.8 Ag-0.7 Cu lead-free solder joints have been performed. The …
array package with Sn-3.8 Ag-0.7 Cu lead-free solder joints have been performed. The …
Are intermetallics in solder joints really brittle?
CC Lee, PJ Wang, JS Kim - 2007 Proceedings 57th Electronic …, 2007 - ieeexplore.ieee.org
In nearly all soldering processes, it is the intermetallic (IMC) layer that bonds the solder to
the base metal. Thus, the IMC layer is necessary for any successful soldering operation …
the base metal. Thus, the IMC layer is necessary for any successful soldering operation …
Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability
The electronic packaging industry uses electroless nickel immersion gold (ENIG) or Cu-
organic solderability preservative (Cu-OSP) as a bonding pad surface finish for solder joints …
organic solderability preservative (Cu-OSP) as a bonding pad surface finish for solder joints …
High-reliability low-Ag-content Sn-Ag-Cu solder joints for electronics applications
Abstract Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy
for packaging of interconnects in the electronics industry, and high-Ag-content SAC alloys …
for packaging of interconnects in the electronics industry, and high-Ag-content SAC alloys …
Thermomechanical behaviour of environmentally benign Pb-free solders
N Chawla - International Materials Reviews, 2009 - Taylor & Francis
Electronic packaging is a critical part of products such as computers, cellular phones,
automotive components and other electronic devices. The package must be tailored to …
automotive components and other electronic devices. The package must be tailored to …
The effect of solder joint microstructure on the drop test failure—a peridynamic analysis
J Mehrmashhadi, Y Tang, X Zhao, Z Xu… - IEEE Transactions …, 2018 - ieeexplore.ieee.org
We investigate the drop reliability of different solder joint microstructures using a coupled
board-level finite-element (FE) analysis and the microscale peridynamic (PD) simulations …
board-level finite-element (FE) analysis and the microscale peridynamic (PD) simulations …