An efficient high-order boundary element method for nonlinear wave–wave and wave-body interactions

H Yan, Y Liu - Journal of Computational Physics, 2011 - Elsevier
A highly efficient high-order boundary element method is developed for the numerical
simulation of nonlinear wave–wave and wave-body interactions in the context of potential …

An analysis of conductor surface roughness effects on signal propagation for stripline interconnects

X Guo, DR Jackson, MY Koledintseva… - IEEE transactions on …, 2014 - ieeexplore.ieee.org
Conductors with a roughened surface have significant effects on high-speed signal
propagation on backplane traces designed for a 10+ Gb/s network. An accurate approach to …

Prediction of losses caused by roughness of metallization in printed-circuit boards

A Deutsch, CW Surovic, RS Krabbenhoft… - IEEE transactions on …, 2007 - ieeexplore.ieee.org
In this paper, the effect of metal roughness on the total loss, the extracted tandelta, and
signal integrity of typical interconnections found in printed-circuit boards is extracted from …

Application of the short-pulse propagation technique for broadband characterization of PCB and other interconnect technologies

A Deutsch, RS Krabbenhoft, KL Melde… - IEEE Transactions …, 2010 - ieeexplore.ieee.org
A comprehensive overview is given of the strengths, limitations, and applicability of the short-
pulse propagation technique (SPP). SPP is shown to be able to extract the broadband …

Chip-to-chip copper interconnects with rough surfaces: analytical models for parameter extraction and performance evaluation

S Kumar, R Sharma - IEEE Transactions on Components …, 2017 - ieeexplore.ieee.org
In multigigahertz integrated circuit design, the extra delay and power losses due to surface
roughness in copper (Cu) interconnects is more evident than ever before and needs utmost …

A stochastic integral equation method for resistance extraction of conductors with random rough surfaces

Q Chen, N Wong - 2006 International Symposium on Intelligent …, 2005 - ieeexplore.ieee.org
Due to the decreasing skin depth in high-frequency analog and digital circuits, surface
roughness is playing an increasingly important role in interconnect parasitic extraction …

Full-wave analysis of large conductor systems over substrate

X Hu - 2006 - dspace.mit.edu
Designers of high-performance integrated circuits are paying ever-increasing attention to
minimizing problems associated with interconnects such as noise, signal delay, crosstalk …

An efficient stochastic integral equation method for modeling the influence of conductor surface roughness on interconnect ohmic loss

Q Chen, N Wong - 2007 50th Midwest Symposium on Circuits …, 2007 - ieeexplore.ieee.org
Due to the shrinking skin depth in high-frequency analog and digital circuits, surface
roughness now has a significant impact on interconnect ohmic loss, which tends to be …

Losses caused by roughness of metallization in printed-circuit boards

A Deutsch, C Surovic, R Krabbenhoft… - IEEE 14th Topical …, 2005 - ieeexplore.ieee.org
In this paper the effect of metal roughness on the total loss, the extracted tan/spl delta/, and
signal integrity of typical interconnections found in printed-circuit boards is extracted from …

Electromagnetic scattering from one-dimensional Gaussian rough surface based on stochastic integral equation

AQ Wang, MN Zhu, ZX Huang - 2020 IEEE MTT-S International …, 2020 - ieeexplore.ieee.org
In this paper, the stochastic integral equation method (SIEM) is proposed to calculate the
electromagnetic scattering from the one-dimensional Gaussian rough surface. In the SIEM …