Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
J Borges, M Darnon, Y Beilliard… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
Current microfabrication approaches face many challenges when scaling down to form
copper lines of less than 2 μm line/space width on organic substrates, resulting in issues …
copper lines of less than 2 μm line/space width on organic substrates, resulting in issues …