In the last five decades, the number of transistors on a chip has increased exponentially in
accordance with the Moore's law, and the semiconductor industry has followed this law as …

With continued scaling, the susceptibility of nanometer CMOS to reliability issues has
increased significantly in analog/mixed-signal (AMS) circuits. The industrial large-scale AMS …

Directed Self-Assembly (DSA) is a very promising emerging lithography for 7nm and
beyond, where a coarse guiding template produced by conventional optical lithography can" …

Studies on further IC development mutually predict that the reliability of future integrated
circuits (ICs) will be severely endangered by the occurrence of electromigration (EM). The …

The ongoing shrinking of interconnects in integrated circuits (ICs) induces reliability issues
caused by electromigration (EM), including void-induced failure mechanisms in IC vias. We …

Asynchronous On-Chip Networks and Fault-Tolerant Techniques is the first comprehensive
study of fault-tolerance and fault-caused deadlock effects in asynchronous on-chip networks …

With increasing temperature and current density, electromigration (EM) becomes a major
interconnect reliability concern for 3-D integrated-circuits (3-D ICs). In 3-D power delivery …

With the continuous scaling of integrated circuit (IC) technologies, electromigration (EM)
prevails as one of the major reliability challenges facing the design of robust circuits. With …

In modern VLSI design, manufacturing yield and chip performance are seriously affected by
via failure. Redundant via insertion is an effective technique recommended by foundries to …

In directed self-assembly lithography (DSAL), vias that are located close are clustered and
patterned together. A large and complex cluster, however, is not allowed in this process due …