A review of fourteen solder joint fatigue models is presented here with an emphasis on
summarizing the features and applications of each fatigue model. The models are classified …

Computer methods have opened a new era for accurate and economic analysis and design
of engineering problems. They account for many significant factors such as arbitrary …

The disturbed state concept (DSC) is a unified, constitutive modelling approach for
engineering materials that allows for elastic, plastic, and creep strains, microcracking and …

Damage mechanics describes the degradation process that takes place in materials and
structures. Traditionally, Coffin–Manson type empirical curves are used to determine the …

A thermomechanical fatigue life prediction model based on the theory of damage mechanics
is presented. The damage evolution, corresponding to the material degradation under cyclic …

This paper aims to substantiate and formulate the main principles of the physical discipline-
mechanothermodynamics that unites Newtonian mechanics and thermodynamics. Its …

Due to the coefficient of thermal expansion (CTE) mismatch between the bonded layers, the
solder joint experiences cycling shear strain, which leads to short cycle fatigue. When …

Computer methods have opened a new era for accurate and economic analysis and design
of engineering problems. They account for many significant factors such as arbitrary …

Pb40/Sn60 is the most commonly used solder alloy for microelectronics packaging. It is well
understood that, heat generated by the circuits when a semiconductor device is on and the …

A thermodynamic framework for damage mechanics is proposed. The damage evolution
function uses entropy as a damage metric. A damage-coupled viscoplastic model with …