The performance of modern chips is strongly related to the multi-layer interconnect structure
that interfaces the semiconductor layer with the outside world. The resulting demand to …

Low dielectric constant dielectrics possess a broad prospect for application in
microelectronic devices. The most efficient method for fabricating low dielectric constant …

In this study, we used a batch-foaming method to prepare closed-cell poly (vinylidene
fluoride)(PVDF) foams with tailored microcellular structures. This is a simple, cost-effective …

Polymer microneedles (MNs) have gained increasing attention as a minimally invasive
method for efficiently delivering drugs and vaccines in a patient-friendly manner. Herein, an …

This paper presents an in-depth overview of the application and impact of UV/VUV light in
advanced interconnect technology. UV light application in BEOL historically was mainly …

Odd–even effects in molecular junctions with self-assembled monolayers (SAMs) of n-
alkanethiolates have been rarely observed. It is challenging to pinpoint the origin of odd …

Integrating bottom-up area-selective building-blocks in microelectronics has a disruptive
potential because of the unique capability of engineering new structures and architectures …

With the rapid development of the fifth-generation mobile communication, stringent
requirements have been put forward for the dielectric properties of polymer-based copper …

High-performance composites with a resin matrix are urgently required for electronic
packaging due to their low dielectric constant, outstanding high temperature resistance …

The propagation of atmospheric pressure plasmas (APPs) on and through porous dielectric
materials is being investigated for plasma-catalysis and functionalizing biomedical materials …