Emerging trends in wide band gap semiconductors (SiC and GaN) technology for power devices

F Roccaforte, P Fiorenza, G Greco, RL Nigro… - Microelectronic …, 2018 - Elsevier
Among the wide band gap (WBG) semiconductors, silicon carbide (4H-SiC) and gallium
nitride (GaN) are nowadays recognized as outstanding materials for the future of power …

Review of technology for normally-off HEMTs with p-GaN gate

G Greco, F Iucolano, F Roccaforte - Materials Science in Semiconductor …, 2018 - Elsevier
Owing to the high carrier density and high electron mobility of the two dimensional electron
gas (2DEG), high electron mobility transistors (HEMTs) based on gallium nitride (GaN) are …

Reliability, applications and challenges of GaN HEMT technology for modern power devices: A review

N Islam, MFP Mohamed, MFAJ Khan, S Falina… - Crystals, 2022 - mdpi.com
A new generation of high-efficiency power devices is being developed using wide bandgap
(WBG) semiconductors, like GaN and SiC, which are emerging as attractive alternatives to …

Selective doping in silicon carbide power devices

F Roccaforte, P Fiorenza, M Vivona, G Greco… - Materials, 2021 - mdpi.com
Silicon carbide (SiC) is the most mature wide band-gap semiconductor and is currently
employed for the fabrication of high-efficiency power electronic devices, such as diodes and …

Ion implantation doping in silicon carbide and gallium nitride electronic devices

F Roccaforte, F Giannazzo, G Greco - Micro, 2022 - mdpi.com
Wide band gap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) are
excellent materials for the next generation of high-power and high-frequency electronic …

Physical unclonable anticounterfeiting electrodes enabled by spontaneously formed plasmonic core–shell nanoparticles for traceable electronics

Q Li, F Chen, J Kang, J Su, F Huang… - Advanced Functional …, 2021 - Wiley Online Library
Counterfeit electronics are a growing problem for the electronic information industry
worldwide, so developing unbreakable security tags is crucial to ensure the trustworthiness …

Superhigh out-of-plane piezoelectricity, low thermal conductivity and photocatalytic abilities in ultrathin 2D van der Waals heterostructures of boron monophosphide …

MK Mohanta, A Rawat, N Jena, R Ahammed… - Nanoscale, 2019 - pubs.rsc.org
A stable 2D van der Waals (vdW) heterobilayer, constituted by boron monophosphide (BP)
and Gallium Nitride (GaN) monolayers, has been explored for different kinds of energy …

The fundamental surface science of wurtzite gallium nitride

VM Bermudez - Surface Science Reports, 2017 - Elsevier
A review is presented that covers the experimental and theoretical literature relating to the
preparation, electronic structure and chemical and physical properties of the surfaces of the …

Tunneling current through non-alloyed metal/heavily-doped SiC interfaces

M Hara, T Kitawaki, H Tanaka, M Kaneko… - Materials Science in …, 2024 - Elsevier
In this paper, tunneling phenomena at metal/heavily-doped SiC Schottky (non-sintered)
interfaces are reviewed, and a design guideline for low-resistance non-alloyed SiC ohmic …

Effect of sintering conditions on the mechanical strength of Cu-sintered joints for high-power applications

JW Yoon, JH Back - Materials, 2018 - mdpi.com
In this study, the feasibility of low-cost Cu-sintering technology for power electronics
packaging and the effect of sintering conditions on the bonding strength of the Cu-sintered …