Study on TSV insulating medium based on SACVD process
Y Shen, L Wang, Q Xu, F Zhou, Y Bai… - Journal of Physics …, 2024 - iopscience.iop.org
TSV silicon switching board technology has the advantages of short global interconnection,
small delay, low power consumption and high integration. The dielectric insulation …
small delay, low power consumption and high integration. The dielectric insulation …
Study of TSV leakage current and breakdown voltage
Y Xu, G Wang, X Sun, R Fang… - 2013 14th International …, 2013 - ieeexplore.ieee.org
Three potential contributing factors to the TSV leakage and breakdown are discussed and
analyzed in this study. In addition, an in-line testing methodology is put forward so that …
analyzed in this study. In addition, an in-line testing methodology is put forward so that …
Low-frequency testing of through silicon vias for defect diagnosis in three-dimensional integration circuit stacking technology
Y Xu, M Miao, R Fang, X Sun, Y Zhu… - 2014 IEEE 64th …, 2014 - ieeexplore.ieee.org
In order to qualify through silicon via (TSV) structures during manufacturing effectively and
efficiently, two low-frequency testing methods were proposed here for electrical property and …
efficiently, two low-frequency testing methods were proposed here for electrical property and …