Chemical mechanical polishing (CMP) is an essential planarization process for
semiconductor manufacturing. The application of CMP has been increasing in …

Water-based suspensions with nanoparticles as additives have been developed to replace
oil-based lubricants for green manufacturing. Optimisation of nanosuspension formulation …

Hybrid manufacturing processes are based on the simultaneous and controlled interaction
of process mechanisms and/or energy sources/tools having a significant effect on the …

Silicon carbide (SiC) is challenging to process by chemical mechanical polishing (CMP)
given its anomaly mechanical hardness and chemically inert. However, improving the SiC …

A novel polishing technique combined with the irradiation of atmospheric pressure plasma
was proposed for the finishing of a silicon carbide material. The irradiation of helium-based …

Single-crystal SiC is a typical third-generation semiconductor power-device material
because of its excellent electronic and thermal properties. An ultrasmooth surface with …

Chemical mechanical polishing (CMP) is an essential semiconductor manufacturing process
because of its local and global planarization ability in fabricating highly integrated devices …

Chemical mechanical planarization (CMP) is a wet polishing technique employed to smooth
the surface of various materials using a combination of chemical and mechanical forces to …

Automation and robotics have the potential to transform the landscape of chemistry and
materials research. However, there are still many repetitive manual processes in the …

Silicon carbide (SiC) is one of the most promising third-generation semiconductor materials
owing to its superior comprehensive performances. However, high-efficient polishing of the …