As the minimum feature size of integrated circuit elements has shrunk below 7 nm, chemical
mechanical planarization (CMP) technology has grown by leaps and bounds over the past …

Along with the remarkable growth in the complexity of semiconductor fabrication technology,
chemical mechanical planarization (CMP) has evolved and become progressively more …

Due to its high optical permeability, excellent high temperature resistance, and chemical
inertness, fused silica (FS) has been widely used in astronomical telescopes, laser systems …

As feature sizes continue to shrink well beyond the 7 nm node, understanding the delicate
balance present in the chemical mechanical planarization (CMP) process is of utmost …

With the rapid miniaturization of advanced technologies, limiting device defects has become
of utmost importance in maintaining high performing integrated circuits. Shallow trench …

Understanding the chemical and mechanical components of supramolecular cleaning
chemistries for post-STI CMP cleaning is paramount in reducing defectivity for the continued …

In shallow trench isolation (STI) chemical mechanical polishing (CMP) of integrated circuits
(ICs), achieving very low Si 3 N 4 removal rate is crucial to ensure proper subsequent …

A scanning mobility particle sizer (SMPS) was used for measuring the size of a sub-10 nm
chemical mechanical planarization slurry abrasive. An atomizer and an electrospray were …

Fused silica (FS) has been widely applied in astronomical telescopes, laser systems, and
optical communication. The excellent fabrication of a fused silica surface requires high …

For improving the three-dimensional structure of phase-change memory devices, Ovonic
threshold switch devices have received renewed attention as selectors owing to a simple …