BACKGROUND Semiconductor devices are used in a variety of electronic applications, such
as personal computers, cellphones, digital cameras, and other electronic equipment, as …

Electrical connections for chip scale packaging are disclosed. In one embodiment, a
semiconductor device includes a post passivation layer disposed overa Substrate, the …

Packaging devices, methods of manufacture thereof, and packaging methods are disclosed.
In some embodiments, a packaging device includes a first substrate including a post …

The embodiments described provide elongated bonded structures near edges of packaged
structures free of solder wetting on sides of copper posts substantially facing the center of …

A method includes forming a first conductive feature and a second conductive feature,
forming a metal pad over and electrically connected to the first conductive feature, and …

The embodiments described above provide enlarged overlap ping Surface areas of bonding
structures between a package and a bonding Substrate. By using elongated bonding struc …

Electrical connections for chip scale packaging are disclosed. In one embodiment, a
semiconductor device includes a post-passivation layer disposed over a substrate, the …

BACKGROUND Generally, a semiconductor die may be connected to other devices external
to the semiconductor die through a type of packaging utilizing solder bumps. The Solder …

Disclosed herein is a mechanism for forming an interconnect comprising forming a
connector on an interconnect disposed on a first surface of a first substrate and applying a …

Related US Application Data which is a continuation of application No. 14/480, 439, filed on
Sep. 8, 2014, now Pat. No. 9,123,788, which is a continuation of application No. 13/667 …