[HTML][HTML] Discharge physics and atomic layer etching in Ar/C4F6 inductively coupled plasmas with a radio frequency bias

MY Yoon, HJ Yeom, JH Kim, W Chegal, YJ Cho… - Physics of …, 2021 - pubs.aip.org
Atomic layer etching (ALE), a cyclic process of surface modification and removal of the
modified layer, is an emerging damage-less etching technology for semiconductor …

[PDF][PDF] Brief review of electron collision studies of molecules relevant to plasma

D Gupta - Appl. Sci. Converg. Technol, 2020 - researchgate.net
ABSTRACT A brief review of the electron collision studies of perfluorocarbons and SF6
relevant to plasma is presented. The use of these gases in various applications of plasma is …

Electron impact elastic and excitation cross-sections of the isomers of C4F6 molecule for plasma modeling

D Gupta, MY Song, KL Baluja, H Choi, JS Yoon - Physics of Plasmas, 2018 - pubs.aip.org
We report the calculations of elastic (along with its symmetry components) and electronic
excitation cross sections by electron impact of the three isomers of C 4 F 6, namely …

A comparative study of electron-impact cross sections of C4F6 isomers from 15 to 5000 eV

A Bharadvaja, S Kaur, KL Baluja - Physics of Plasmas, 2019 - pubs.aip.org
Electron-impact differential, integral, and momentum transfer cross sections (CS) are
computed for C 4 F 6 isomers from 15 to 5000 eV by employing the Single Center Expansion …

Brief Review of Atomic Layer Etching Based on Radiofrequency-Biased Ar/C₄F₆-Mixture-Based Inductively Coupled Plasma Characteristics

MY Yoon, HJ Yeom, JR Jeong, JH Kim… - Applied Science and …, 2023 - dbpia.co.kr
Among the next-generation semiconductor manufacturing processes, plasma-assisted
atomic layer etching (ALE) has garnered significant attention along with an increase in …

Plasma Surface Modification of Polymers for Biomedical Uses

PL Thi, M Myoung-Woon - Plasma Modification of Polyolefins: Synthesis …, 2022 - Springer
Polyolefins (POs) are a class of synthetic polymers that appear most popularly in daily uses.
Despite the natural hdydrophobic characteristic of these materials, the applications of them …