As the core carrier of information storage, a semiconductor memory device is a basic product
with a large volume that is widespread in the integrated circuit industry. With the rapid …

We investigate the drop reliability of different solder joint microstructures using a coupled
board-level finite-element (FE) analysis and the microscale peridynamic (PD) simulations …

Electronic components are prone to failure due to shock or vibration loads. To predict when
this failure may occur it is necessary to calculate the vibration response of the printed circuit …

The sequential thermal cycling (TC) and drop impact test are more reasonable to evaluate
the reliability of lead-free solder interconnections compared with separate TC test or drop …

The purpose of this study is to establish a predictive fatigue life model for SAC 105 (Sn-1.0
Ag-0.5 Cu) and SAC 1205N (Sn-1.2 Ag-0.5 Cu with nickel) lead-free solder alloys. A …

Lead free solders are replacing lead rich solders in the electronic industry, the performance
and safety of lead free solder interconnects in electric packaging under drop impact …

This article is dedicated to the review of publications on drop impact analysis performed on
consumer electronic devices such as cellular phones and two-way radios in the past …

In this study, reliability performances of board-level chip-scale packages subjected to four
JEDEC drop test conditions: A (500G; 1.0 ms), B (1500G; 0.5 ms), F (900G; 0.7 ms), and H …

Drop test reliability of the 20 mm× 20 mm RDL-first FOWLP on bottom and 8 mm× 8 mm
WLCSP on top for Package on Package (PoP) test vehicle was validated by the …

Precision guided projectiles (PGPs) experience severe shock loads during launch
emanating from the propellant gasses and the surrounding air. Our most recent multiphysics …