MEMS inductors are used in a wide range of applications in micro-and nanotechnology,
including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies …

Recently, there have been notable advancements in energy harvesting from various
sources, including mechanical vibrations, thermal gradients, and electromagnetic and solar …

This article introduces a methodology to increase the integration density of functional
electronic features on fibers/threads/wires through additive deposition of functional materials …

A 4× 4 Butler matrix for millimeter-wave communications is presented in this paper. The
circuit takes advantage of a new 3-D Integrated Passive Devices (IPD) process to achieve a …

Silicon technologies for HF applications have been proven for more than two decades, and
technologies have greatly evolved. Whether CMOS or BiCMOS technologies, the unique …

A wideband and compact quadrature coupler intended for 5G applications is presented. The
circuit is integrated using a dedicated cost-effective three-dimensional (3-D) technology and …

Networking technologies have become increasingly omnipresent over the past two decades.
In particular, 5G (fifth generation) is expected to support significantly faster mobile broad …

The new 3D packaging technology based on 3D-redistribution layer (RDL) copper
interconnect is proposed for 5G highly-integrated RF system in-package (SIP) applications …

Une matrice de Butler 4× 4 large bande couvrant simultanément les fréquences 5G de 26
GHz et de 28 GHz est présentée. Sur la bande 25-29 GHz, les résultats obtenus rapportent …

Les travaux de thèse ont porté sur la valorisation et l'évolution d'une filière technologique 3D
faible coût permettant l'intégration de composants passifs 3D. Afin de démontrer le potentiel …