A review of mechanical properties of lead-free solders for electronic packaging
H Ma, JC Suhling - Journal of materials science, 2009 - Springer
The characterization of lead-free solders, especially after isothermal aging, is very important
in order to accurately predict the reliability of solder joints. However, due to lack of …
in order to accurately predict the reliability of solder joints. However, due to lack of …
Machine learning framework for predicting the low cycle fatigue life of lead-free solders
This study explores an efficient and reliable machine learning framework for determining the
low cycle fatigue life of lead-free solders, which does not necessarily separately test different …
low cycle fatigue life of lead-free solders, which does not necessarily separately test different …
Magnetic alignment of hexagonal boron nitride platelets in polymer matrix: toward high performance anisotropic polymer composites for electronic encapsulation
We report magnetic alignment of hexagonal boron nitride (hBN) platelets and the
outstanding material properties of its polymer composite. The magnetically responsive hBN …
outstanding material properties of its polymer composite. The magnetically responsive hBN …
Reliability behavior of lead-free solder joints in electronic components
L Zhang, J Han, C He, Y Guo - Journal of Materials Science: Materials in …, 2013 - Springer
With more consumer products moving towards environmentally friendly packaging, making
solder Pb-free has become an urgent task for electronics assemblies. Solder joints are …
solder Pb-free has become an urgent task for electronics assemblies. Solder joints are …
Failure and reliability analysis of a SiC power module based on stress comparison to a Si device
The superior electro-thermal properties of silicon carbide (SiC) power devices permit higher
temperature of operation and enable higher power density compared with silicon devices …
temperature of operation and enable higher power density compared with silicon devices …
Unveiling the damage evolution of SAC305 during fatigue by entropy generation
Low-cycle thermal-mechanical fatigue loadings induce progressive and permanent
degradation of mechanical properties of lead-free solder materials, and thus reduce the …
degradation of mechanical properties of lead-free solder materials, and thus reduce the …
Reliability of the aging lead free solder joint
Solder materials demonstrate evolving microstructure and mechanical behavior that
changes significantly with environmental exposures such as isothermal aging and thermal …
changes significantly with environmental exposures such as isothermal aging and thermal …
The influence of elevated temperature aging on reliability of lead free solder joints
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
The effects of aging temperature on SAC solder joint material behavior and reliability
The effects of aging on mechanical behavior of lead free solders have been examined by
performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) …
performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) …
Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packages
The microstructure, mechanical response, and failure behavior of lead-free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …