With the development of science and technology, consumers' requirements for various
electronic devices present a trend of more diverse functions and thinner bodies. This makes …

Fatigue failure of solder joints is one of the major causes of failure in electronic devices.
Fatigue life prediction models of solder joints were first put forward in the early 1960s, and …

As temperature cycling drives fatigue failure of solder joints in electronic modules,
characterisation of the thermal fatigue response of different solder alloy formulations in BGA …

One of the crucial factors in determining the reliability of an electronic device is fatigue
failure of the interconnecting solder joints. In most cases, large bulk samples are used to …

Solder joints reliability is a determinant factor for the life of the electronic assemblies. In this
study, the reliability of actual SAC305 solder joints is investigated using accelerated shear …

Reliability of conventional electronic assemblies in real service applications is typically
limited by fatigue failure of a single solder joint in reversed cyclic loading. Fatigue damage …

Reliability of microelectronic assemblies is typically limited by the fatigue failure of one of the
interconnected solder joints. The fatigue behavior of the lead-free solder joints doped with …

Reliability of an electronic component is typically limited by fatigue failure of one of the
interconnected solder joints. For harsh applications, where high reliability is required, solder …

Solder joints in electronic assemblies are subjected to mechanical and thermal cycling.
These cyclic loadings lead to the fatigue failure of solder joints involving damage …

The reliability of an electronic assembly is limited by a fatigue failure of one of the
interconnected solder joints. Fatigue properties of the common lead free solder joints have …