Improving the performance of aqueous zinc‐ion batteries by inhibiting zinc dendrite growth: recent progress

VC Ho, H Lim, MJ Kim, J Mun - Chemistry–An Asian Journal, 2022 - Wiley Online Library
Aqueous zinc‐ion batteries (ZIBs) are promising candidates for the next‐generation high‐
energy storage devices, owing to their resource availability, low cost, eco‐friendliness, and …

Experimental and theoretical study of the new leveler basic blue 1 during copper superconformal growth

Y Li, C Li, R Li, X Peng, J Zhang, P Yang… - … applied materials & …, 2023 - ACS Publications
A novel chlorinated functional group-modified triphenylmethane derivative leveler BB1 is
used to achieve superconformal electrodeposition in microvias. Cyclic voltammetry (CV) and …

Benzyl-containing quaternary ammonium salt as a new leveler for microvia copper electroplating

Y Meng, M Zhou, W Huang, Y Min, X Shen, Q Xu - Electrochimica Acta, 2022 - Elsevier
Recently, quaternary ammonium salt is considered as an effective leveler because of its
easy adsorption on the cathode surface. However, quaternary ammonium salt compounds …

Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications

ZY Wang, L Jin, G Li, JQ Yang, WQ Li, DP Zhan… - Electrochimica …, 2022 - Elsevier
An organic additive, gentian violet (GVT), is explored for the first time as a novel leveler with
excellent property in through-holes (THs) metallization of Cu electronic plating in acidic …

Investigation of synthesized carbazole derivative Cz-BPDB as a high-performance leveler for copper electroplating

B Yuan, W Zhou, X Li, Y Xie, X Yin, X Chen… - Surface and Coatings …, 2023 - Elsevier
Electroplating additives, especially levelers of copper electroplating, are the most critical
components of electroplating solutions in the manufacture of printed circuit boards and …

[HTML][HTML] Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers

ZJ Peng, Z Li, Y Jiao, N Zhang, Q Zhang, B Zhou… - Nano Materials …, 2024 - Elsevier
Copper metal is widely electroplated for microelectronic interconnections such as
redistribution layers (RDL), pillar bumps, through silicon vias, etc. With advances of …

Anomalous vertical twins with high (2 2 0) texture in direct current electroplating copper film

P Zhang, L Zhang, X Qu - Applied Surface Science, 2023 - Elsevier
The regulation of crystal structure and orientation during direct current (DC)
electrodeposition is one of the key factors for achieving performance control of the …

Electroplated Copper Additives for Advanced Packaging: A Review

L Guo, S Li, Z He, Y Fu, F Qiu, R Liu, G Yang - ACS omega, 2024 - ACS Publications
Acid copper electroplating stands as a core technology in advanced packaging processes,
facilitating the realization of metal interconnects, bumps, vias, and substrate wiring between …

Quantum chemical calculations and molecular dynamics simulations to investigate the mechanism of interaction of six dye levelers with copper surface

X Li, P Zou, X Chen, L Wang - Journal of Electroanalytical Chemistry, 2024 - Elsevier
Six dye levelers are researched by quantum chemical calculations and molecular dynamics
simulations. The electrostatic potential (ESP) and Hirshfeld charge of the levelers were …

Alkyl-terminated PEG suppressors for copper electroplating and their hydrophilic and hydrophobic properties

C Han, Y Zhai, Y Chen, J Li, W Cai, Z Zhou… - Surface and Coatings …, 2024 - Elsevier
This study explores the structure-activity relationship of copper electroplating suppressors,
with a focus on alkyl-terminated polyethylene glycols (PEGs), to better understand their …