Aluminum nitride (AlN) ceramics possess exceptional comprehensive properties in terms of
thermal, electrical, and mechanical aspects. The joining of AlN ceramics with metals enables …

Electric field-assisted sintering technology (FAST) was used to join SiC ceramic by using a
CoFeCrNiCu high-entropy alloy filler. A thin Ti film was deposited on SiC surface by physical …

The wettability of graphite by SnAgCu-Ti alloys was investigated by sessile drop method in
vacuum. Bonding of graphite to itself using SnAgCu-Ti alloys was carried out and the joint …

Abstract Silver‐titanium (Ag‐Ti) paste was used to prepare copper‐metalized aluminum
nitride (AlN) substrate under 2 MPa by brazing. The effects of Ti concentration and brazing …

Ultrasonic-assisted metal droplet deposition (UAMDD) is currently considered a promising
technology in droplet-based 3D printing due to its capability to change the wetting and …

The development of highly performance thermal management material becomes critical in
recent years due to the high integration of electronic products. In order to prolong the …

Joining of graphite materials is problematic primarily due to the poor wettability of non-active
filler metal on these materials. In an attempt to overcome this problem, magnetron sputtering …

Abstract Carbon/carbon (C/C) composites and T2 copper (Cu) alloy were successfully
welded by the following two-step process: the pre-metallization on C/C composites was …

The wettability of zirconia with Sn0. 3Ag0. 7Cu-Ti (SAC-Ti) alloys was investigated via the
sessile drop method with the increase of temperature. Zirconia, pre-metallized with SAC-Ti …

Aiming to address the issue of aluminum slag adhering to the interior walls of vacuum lifting
ladles in the aluminum electrolysis industry, Molecular dynamics simulations are employed …