The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …

Stair ascent is an activity of daily living and necessary for maintaining independence in
community environments. One challenge to improving an individual's ability to ascend stairs …

Consistent with the recent trends in which the flip-chip reliability and performance being
prominently prioritized, this paper is devoted to study the effects of solder bump shapes on …

This paper presents a new analytical filling time model to predict the flow of non-Newtonian
underfill fluid during flip-chip encapsulation process. The current model is formulated based …

Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …

Purpose This paper aims to introduce a new indicative parameter of filling efficiency to
quantify the performance and productivity of the flip-chip underfill encapsulation process …

Prediction of void occurrence during capillary underfill encapsulation process is vital to
avoid package failure due to incomplete filling during the encapsulation process. Two …

This paper investigated the variation variables on the void formation in the no-flow underfill
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …

Underfill encapsulation process regularly encounters productivity issue of long filling time
that incurs additional manufacturing costs. The package was optimized to attain least filling …

Purpose In line with the recent development of flip-chip reliability and underfill process, this
paper aims to comprehensively investigate the effect of different hourglass shape solder …