US9704793B2 - Substrate for electronic device and electronic device - Google Patents
US9704793B2 - Substrate for electronic device and electronic device - Google Patents Substrate …

(57) ABSTRACT A method of and device for forming vias on an electronic board (such as a
PCB board) comprises forming one or more holes on the electronic board, placing a …

(51) Int. Cl. An embedded component is formed in a PCB stack by H05K L/18(2006.01)
applying an adhesive layer across an entire Surface of a HOSK 3/It(2006.01) copper layer …

US10645807B1 - Component attach on metal woven mesh - Google Patents US10645807B1 -
Component attach on metal woven mesh - Google Patents Component attach on metal woven …

Embodiments of the present invention relate to nano-copper pillar interconnects. Nano-
copper material is a mixture of nano-copper particles and one or more organic fluxes. In …

US11668686B1 - Batteryless architecture for color detection in smart labels - Google
Patents US11668686B1 - Batteryless architecture for color detection in smart labels …

A PCB based electrochemical sensor includes a PCB having a first electrode on a first
surface of the PCB, and a second electrode on a second surface. A sensing element, such …

An assembly platform for arrangement as an interposer device between an integrated circuit
and a substrate to interconnect the integrated circuit and the substrate through the assembly …

A process of constructing a filled via of a printed circuit board comprises drilling a via hole
through a body of the printed circuit board, desmearing a barrel of the via hole, metallizing a …

0002 1. Field of the Invention 0003. The present invention relates generally to a printed
circuit board and a method of manufacturing the printed circuitboard, and, more particularly …