[图书][B] Integrated optical circuits and components: Design and applications

EJ Murphy - 2020 - books.google.com
Integrated optical circuits and components: Design and applications Page 1 INTEGRATED
OPTICAL CIRCUITS AND COMPONENTS DESIGN AND APPLICATIONS IP DWDM OCC DWDM …

[PDF][PDF] Molten-alloy driven self-assembly for nano and micro scale system integration

E Saeedi, S Abbasi, KF Böhringer… - Fluid Dyn. Mater …, 2006 - labs.ece.uw.edu
Self-assembly is emerging as one of the main methods for construction of heterogeneous
systems consisting of multiple component types in nano-and micro-scales. The engineered …

Residual free solder process for fluxless solder pastes

A Hanss, G Elger - Soldering & Surface Mount Technology, 2018 - emerald.com
Purpose For soldering, flux is essential because it enables the wetting of the molten solder.
Fluxless soldering, ie residue-free soldering with the aid of gaseous activators, has been …

Lateral capillary forces of cylindrical fluid menisci: a comprehensive quasi-static study

M Mastrangeli, JB Valsamis, C Van Hoof… - Journal of …, 2010 - iopscience.iop.org
Capillarity is pivotal to many important technologies, including capillary self-alignment and
self-assembly for heterogeneous microsystem integration and packaging. Lateral capillary …

Integrated structural and controller optimization in dynamic mechatronic systems

A Albers, J Ottnad - 2010 - asmedigitalcollection.asme.org
In order to take into account the interaction between the part, dynamic system, control
system, and changing mechanical behavior with all its consequences for the optimization …

Advanced induction motor endring design features for high speed applications

MT Caprio, V Lelos, JD Herbst… - … Conference on Electric …, 2005 - ieeexplore.ieee.org
This paper presents advancements in induction motor endring design to overcome
mechanical limitations and extend the operating speed range and joint reliability of induction …

Structure-borne sound characterization of coupled structures—Part I: simple demonstrator model

G Pavić, AS Elliott - 2010 - asmedigitalcollection.asme.org
A method has been developed to characterize a vibration source when coupled via resilient
mounts to a receiver structure. This two-step measurement procedure can deliver the …

Study of the self-alignment of no-flow underfill for micro-BGA assembly

YC Chan, PL Tu, KC Hung - Microelectronics Reliability, 2001 - Elsevier
As a concept to achieve high throughput low cost flip-chip assembly, a process development
activity is underway, implementing next generation flip-chip processing based on large area …

Single chip bumping and reliability for flip chip processes

M Klein, H Oppermann, R Kalicki… - Microelectronics …, 1999 - Elsevier
Processes of bump deposition based on mechanical procedures together with their
reliability data are summarized in this paper. The stud bumping of gold, palladium, and …

Fundamentals of fluxless soldering technology

CC Lee, J Kim - Proceedings. International Symposium on …, 2005 - ieeexplore.ieee.org
Fluxless (flux-free) soldering technology deals with investigating and developing techniques
and methods that can eliminate the use of fluxes in the soldering process. The fluxless …