Cu@ Sn core-shell structured particles with different coating layer thicknesses were
fabricated and used as bonding materials. The microstructure evolution and thermostability …

This study introduces research trends in the electronics materials, such as joining materials
including high-temperature lead-free solder, sintered materials using metal particles and …

Lead-based alloys are conventionally used for soldering interconnections that are expected
to perform at high temperatures. Because of the concerns of lead toxicity, the development of …

Researchers have been working for some times to develop a Pb-free substitute for high-Pb
containing solders in electronics. In this study the effect of Mg content on microstructure …

The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to
study the direct soldering of silicon and copper. Bi11Ag1. 5Ti solder has a broad melting …

In this study, the newly developed Zn based solder alloys with different amount of Sb doping
(ie Zn–1.2 wt% Sb, Zn–1.7 wt% Sb and Zn–2.2 wt% Sb) were investigated for …

Lead-based solders are widely used for making interconnections between electronic chips
and a circuit board that is expected to perform at high temperatures. The substitution of …

The issue of substituting high lead (Pb) solders in elevated temperature applications such as
in high power module devices has been a major concern due to the potential toxicity of lead …

The discovery of microelectronic devices revolutionized the world. However, the
performances of these devices are related to the generation of heat and associated with …

Abstract In the present work, 0.2 wt% Ni and 0.1–0.5 wt% RE (Ce and La mixed rare-earth)
were added into Zn–20Sn high-temperature lead-free solders. The effects of Ni and RE …