During soldering and service, intermetallic compounds (IMCs) have an important impact on
the performance and reliability of electronic products. A thin and continuous intermetallic …

As to promote the performance of the solder joints applied to electronics industry, the
researchers take advantage of micro/nano-sized particles or another element coated on …

During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

In this study, ultra-small nano-Ag particles with an average diameter of 4.76 nm and
excellent stability have been synthesized on a large scale to meet low-temperature, low …

Light-emitting diodes (LEDs) are considered an ideal substitute for low-efficiency traditional
light sources with broad applications in all scientific disciplines. For the past recent years …

In this paper, new type Cu nanoaggregates (Cu NAs) were designed, and the Cu-Cu
bonding by Cu NAs was investigated. The Cu NAs were obtained by agglomeration of the …

Incorporating various types of ceramic type nanoparticles into Pb-free solder pastes
produces unique nanocomposite solder pastes. In this study, Sn–Ag–Cu (SAC) 305 solder …

This study examined the addition of dual ceramic nanomaterials, TiO 2 and graphene (0,
0.03, 0.12, 0.21, and 0.60 wt%), to a lead-free Sn-3.0 wt% Ag-0.5 wt% Cu (SAC305) solder …

This paper is focused on the effect of TiC nano-reinforcement that was successfully
introduced into a SAC305 lead-free solder alloy with different weight fractions (0, 0.05, 0.1 …

Abstract Plating Sn3Ag on copper substrates represents a crucial electronic packaging
technique. In this study, we propose a novel composite plating approach, wherein CoSn 3 …