Wafer bonding of thinned electronic materials and circuits to high performance substrates
FJ Kub, KD Hobart - US Patent 7,535,100, 2009 - Google Patents
A method of bonding a wafer to a substrate comprising the steps of: providing a wafer having
a front surface and a back surface; attaching the front surface of the wafer to a support; …
a front surface and a back surface; attaching the front surface of the wafer to a support; …
Process for lift off and handling of thin film materials
ME Sickmiller - US Patent 6,214,733, 2001 - Google Patents
A process for lift-off of at least one thin film layer situated on a substrate is disclosed,
including the steps of: depositing a support layer such as polymer on the thin film layer …
including the steps of: depositing a support layer such as polymer on the thin film layer …
Thin flip—chip method
FB Grigg, TL Jackson - US Patent 6,506,681, 2003 - Google Patents
The present invention relates to a method of thinning Semiconductor wafers. More
Specifically, the present inven tion relates to a method of Supporting bumped Semiconduc …
Specifically, the present inven tion relates to a method of Supporting bumped Semiconduc …
Method of separating layers of material
J Park, JP Sercel, PJ Sercel - US Patent 7,202,141, 2007 - Google Patents
GaN/InGaN-based Light-Emitting Diodes (LEDs), known as “Blue LEDs, have a promising
future. Practical applications for these GaN/InGaN-based LEDs have been expanding to …
future. Practical applications for these GaN/InGaN-based LEDs have been expanding to …
Methods of thinning microelectronic workpieces
T Jiang - US Patent 6,548,376, 2003 - Google Patents
(54) METHODS OF THINNING 5,656,552 A 8/1997 Hudak et al. MICROELECTRONIC
WORKPIECES 5,891,797 A 4/1999 Farrar 5,930,652 A 7/1999 Mukerji et al.(75) Inventor …
WORKPIECES 5,891,797 A 4/1999 Farrar 5,930,652 A 7/1999 Mukerji et al.(75) Inventor …
Encapsulated semiconductor components and methods of fabrication
W Farnworth, A Wood, T Doan - US Patent App. 10/646,897, 2005 - Google Patents
A semiconductor component includes a thinned semiconductor die having protective
polymer layers on up to six surfaces. The component also includes contact bumps on the die …
polymer layers on up to six surfaces. The component also includes contact bumps on the die …
Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby
T Jiang, L Li, WM Hiatt - US Patent 7,268,012, 2007 - Google Patents
Methods for creating redistribution layers for only selected dice, such as known good dice, to
form relatively thin semiconductor component assemblies and packages, and the …
form relatively thin semiconductor component assemblies and packages, and the …
Electronic modules and methods for forming the same
LM Racz, GB Tepolt, JC Thompson, TA Langdo… - US Patent …, 2011 - Google Patents
US8017451B2 - Electronic modules and methods for forming the same - Google Patents
US8017451B2 - Electronic modules and methods for forming the same - Google Patents …
US8017451B2 - Electronic modules and methods for forming the same - Google Patents …
Wafer reinforcement structure and methods of fabrication
KK Kirby - US Patent 7,244,663, 2007 - Google Patents
A method of fabricating a thinned, reinforced semiconductor wafer is disclosed. Particularly,
a semiconductor wafer may be provided and a plurality of separate semiconductor dice may …
a semiconductor wafer may be provided and a plurality of separate semiconductor dice may …
Semiconductor wafer thinning
C Hernandez - US Patent App. 11/748,995, 2007 - Google Patents
US20070218649A1 - Semiconductor wafer thinning - Google Patents US20070218649A1 -
Semiconductor wafer thinning - Google Patents Semiconductor wafer thinning Download PDF …
Semiconductor wafer thinning - Google Patents Semiconductor wafer thinning Download PDF …